論文
Takayo Yamamoto, Tomio Nagayama, Toshihiro Nakamura:Thermal Expansion and Thermal Stress Behavior of Electroless-Plated Fe–Ni–B Alloy Thin Film for High-Density Packaging, Journal of The Electrochemical Society, 166(1), D3238-D3245(2019)
山本 貴代,永山 富男,中村 俊博,水谷 泰:インバー合金電析膜の熱膨張特性,表面技術,62(12), 702-707(2011)
Tomio Nagayama, Takayo Yamamoto, Toshihiro Nakamura:Thermal expansions and mechanical properties of electrodeposited Fe–Ni alloys in the Invar composition range, Electrochimica Acta, 205, 178-187(2016)